Item Name

  High purity Nickel target 4N Ni target 99.99% 

Purity

 99.99%   99.995%

Shape

Flat target, according to your request

Available size

Round: dia 25~550mm,Thickness:3~30mm

Rectangular: Length up to 2000mm

Customization is available

Certificates

ISO9001:2008, SGS, The third test report

Technics

Hot Isostatic Pressing(HIP), Powder Metallurgy, Patented Thermo-mechanical process

Application

Widely used in coating processing industries:

A: LCD , photoelectric devices field.

B: Electronic and semiconductor field.

C: Decoration and mould field.

 Advantages

 Microstructure: Uniform equiaxed fine grain, consistent microstructure, average grain size <100μm

Detailed Information

Niobium is gray metal, could form alloys with titanium, zirconium, hafnium, tungsten.

Niobium, tantalum cooperating with tungsten, molybdenum, vanadium, nickel, cobalt and other metals get "hot strong alloy”, which can be used as structural materials of supersonic jets, rockets and missiles.

Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes. The process is repeatable and can be scaled up from small research and development projects, to production batches involving medium to large substrate areas. The sputtering gas is often an inert gas such as argon. For efficient momentum transfer projectile mass must match target mass, so for sputtering light elements neon is also used and for heavy elements krypton or xenon. Reactive gases are used to sputter compounds. The chemical reaction can occur on the target surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process but allow experts a large degree of control over the growth and microstructure of the film.

To achieve the desired characteristics in a sputter deposited thin film, the manufacturing process used to fabricate the sputtering target can be critical. Whether the target material comprises only an element, mixture of elements, alloys, or perhaps a compound; the process to produce that defined material in a form suitable for sputtering thin films of consistent quality is as essential as the deposition run parameters perfected by the thin film process engineers and scientists.

Quality Standard (99. 95% Nb)

Element

Value(≤ppm)

Element

Value(≤ppm)

Ta

100

Fe

5

O

20

Mo

5

N

30

W

5

C

10

Ti

5

Si

5

Cu

5